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Dexerials

NP605

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Dexerials NP605 Special resin-based hot melt double-sided tape

Product Overview

Dexerials NP605 is a high-performance hot-melt double-sided tape (Hotmelt Double Coated Tape) with special resin as the base material and non-woven fabric as the middle core material. The tape has low-temperature heat activation properties and can achieve bonding at a minimum of 90°C. It can exhibit excellent adhesion at 100°C and above and maintain stable bonding strength over a wide temperature range. The adhesive surface is tack-free at room temperature and supports punching, die-cutting and processing operations without release paper, which can significantly improve the appearance design and assembly quality of the end product

Core Features

  • Low-temperature thermal activation: Activation bonding can begin at 90°C, and excellent bonding force can be fully exerted above 100°C

  • Wide temperature range stability: After curing and bonding, excellent bonding force can be maintained in a wide temperature range

  • Non-sticky at room temperature (easy to process): The surface is not sticky at room temperature, punching, die-cutting and waste removal processing are smooth, and it is not easy to overflow glue or stick to the jig

  • Excellent bonding of metal and plastic: Designed for high-reliability composite fixation of various plastics (ABS, PS, PC/ABS, etc.) and metal materials (aluminum plates, stainless steel, SUS, etc.)

Basic structure and physical parameters

Inspection itemsSpecifications PDFRemarks/Test Standard PDF
Main components of adhesive

Special resin base

Hot melt type

Substrate (Carrier)

Nonwoven fabric

Middle core layer

Color

Translucent white

Total tape thickness

About 85 µm

Double-sided tape contains base material

Release paper thickness

About 60 µm

Adhesive strength (breaking strength)

98.1 N / 40mm × 40mm

Aluminum plate and ABS bonded (hot pressing 120°C)

Standard roll size

400 mm (width) × 100 m (length)

Roll supply

Recommended hot pressing process conditions

  • Hot pressing temperature: 90°C ~ 140°C

  • Hot pressing time: 8 ~ 15 seconds

  • Hot pressing pressure: 0.2 ~ 0.3 MPa

Technical measured data and reliability performance

  • Cleavage strength at different hot pressing temperatures:

    • Test conditions: aluminum plate (t=0.4mm) and polystyrene PS plate (t=5mm), bonding area 40×40mm, pressure 0.3MPa, hot pressing time 10 seconds

    • The breaking force under hot pressing at 90°C has reached approximately 215 N; when the temperature rises to At 110°C~140°C, the bonding force is stable at 230 ~ 250 N / 40×40mmHigh quality

  • Hard working conditions tolerance and aging reliability:

    • Hot and cold cycle test (-30°C×3h + 70°C×3h,Cycle 10 times): The breaking strength of the sample at each hot pressing temperature remains stable at 200 ~ 270 N.

    • High temperature and high humidity aging (65°C / 80%RH for 7 days and 14 days): The bonding interface has excellent performance, the strength is maintained above 200 ~ 350 N, and there is no degumming and embrittlement

  • Adhesive strength (temperature resistance test) under different operating temperature environments:

    • In a low temperature environment of -40°C ~ 0°C, the breaking strength exceeds 300 N

    • Normal temperature 20°C is about 250 N, even at 60°C it is still about 160 N, and the bonding force (about 90 N) is still maintained at 80°C high temperature

  • Shear strength at different hot pressing temperatures:

    • Test conditions: stainless steel SUS board (t=0.5mm) and PC/ABS board (t=5mm), bonding area 20×20mm (4 cm²), pressure 0.3MPa, holding pressure 10 seconds

    • Shear force at 90°C is 126 N; At a lamination temperature of 100°C ~ 150°C, the shear strength is stable at 156 ~ 175 N / 4cm²

Applicable fields

  • Composite fixation of metal decorative parts and plastic casings for various handheld smart terminals, home appliances and instrument panels

  • Structural pasting between the speaker grille, earpiece metal mesh and plastic middle frame

  • Structural bonding parts that require no solvent evaporation, excellent temperature resistance and precision die cutting and punching.


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