HIGER BOND HB-268 flame retardant grade high insulation electronic white glue (polyester component fixing glue / UL 94V-0)

Product Overview

HB-268 is a high-performance solvent-based electronic special adhesive and fixing glue (electronic white glue) with copolyester polymer (Co-Polyester) as the main base material.. Appearance: white, high viscosity and delicate paste, via U.S.UL 94V-0 flame retardant certification (File No. E117973), and has been tested by SGS and fully complies with the EU RoHS environmental regulations.。

This product has high solid content, excellent thixotropic anti-sag properties and excellent filling and sealing capabilities., in electronic assembly, it can achieve full dispensing molding without collapse or sagging.. High hardness after curing (Shore A 98+), combining excellent heat resistance, thermal aging resistance, ultra-high electrical insulation resistance and strong bonding shear force, can-30℃ to 170℃Long-term stable protection components in harsh temperature ranges, widely used in seismic fixation and insulation protection of components of various switching power supplies, adapters, display high-voltage boards and various industrial control home appliance motherboards。

Core advantages and features

• Authoritative UL 94V-0 flame retardant certification:It has excellent self-extinguishing performance upon separation from fire and has passed UL Yellow Card certification (UL 94V-0, File No. E117973), meeting stringent electronic and electrical fire safety regulations.。

• Excellent ultra-high electrical insulation properties:

• The initial surface impedance before drying reaches$5 imes 10^{9} Omegacdot ext{cm}$；

• After drying, the surface insulation resistance reaches$1.49 imes 10^{14} Omegacdot ext{cm}$；

• throughAfter 720 hours of continuous heat aging at 145℃ extreme high temperature, the surface insulation resistance remains at$1.55 imes 10^{15} Omegacdot ext{cm}$, excellent insulation stability；

• Dielectric breakdown strength up toDC 25 kV/mm（ASTM D 149）。

• Excellent thermal aging resistance (temperature resistance up to 170℃):Suitable for working environment from -30℃ to 170℃, the bonding shear strength does not decrease but increases after being heated and baked and used for a long time.。

• Excellent thixotropy and non-sagging:High viscosity paste (120,000~150,000 cps), the facade glue will not sag and the glue can be cut off neatly, which facilitates the application of glue and accumulation at the roots of vertical components.。

• High solids content and excellent gap filling properties:Solid content up to58% ~ 64%, small curing volatilization shrinkage, excellent filling and coating effect on gaps in large gap components。

• Broad, high-strength adhesion:Excellent shear strength for electronic structural materials such as copper, aluminum, epoxy fiberglass board (FR-4 / G.E.), ABS, PVC, acrylic (PMMA)。

Basic physical properties and technical indicators

Mechanical Bonding and Electrical Performance Data

1. Shear strength test (ASTM D 412 standard, unit: kg/cm²)

• Copper / Copper (Cu / Cu):Before baking 39.7 (CF colloid breaks)$ ightarrow$ 60℃ × 168h up to 85.8 after heat aging (CF colloid rupture)

• Epoxy fiberglass board/aluminum board (G.E./Al):Before baking 30.6 (CF)$ ightarrow$ 60℃ × 168h Up to 76.0 after heat aging (AF joint surface cracked)

• Copper/Acrylic Sheet (Cu/PMMA):Before baking 32.9 (AF)$ ightarrow$60℃ × 168h after heat aging 37.8 (AF/CF)

• PVC/Epoxy fiberglass board (PVC/G.E.):Before baking 29.7 (CF)$ ightarrow$60℃ × 168h after heat aging 37.3 (AF/CF)

• Epoxy board / acrylic board (G.E. / PMMA):Before baking 27.2 (AF)$ ightarrow$60℃ × 168h after heat aging 36.1 (CF)

• Copper/ABS (Cu/ABS):Before baking 28.1 (AF/CF)$ ightarrow$60℃ × 168h after heat aging 30.2 (AF)

• Aluminum/ABS (Al/ABS):Before baking 18.8 (CF)$ ightarrow$60℃ × 168h after heat aging 29.5 (CF)

• PVC/Acrylic sheet (PVC/PMMA):Before baking 22.7 (AF)$ ightarrow$60℃ × 168h after heat aging 25.8 (AF)

2. Electrical insulation property data (ASTM D 257 test specification)

• Undried initial wet surface impedance: $5 imes 10^{9} Omegacdot ext{cm}$

• Surface insulation resistance (1.27mm comb electrode, 100℃×4h and then lowered to room temperature): $1.49 imes 10^{14} Omegacdot ext{cm}$

• High temperature and long-lasting thermal aging surface resistance (145℃ ± 2℃ × 720h): $1.55 imes 10^{15} Omegacdot ext{cm}$

• Dielectric breakdown strength (ASTM D 149): DC 25 kV/mm

Typical application areas

1. Anti-vibration fixation of PCB board vertical components:Root dispensing fixation and anti-drop buffering of heavy components such as power adapters, TV boards, and switching power supplies such as large-capacity electrolytic capacitors, filter inductors, jumpers, and transformers.。

2. Insulation protection of high voltage components:Insulation coating and anti-creeping of sensitive components around transformer pins, high-voltage rectifier packages, and display modules。

3. Dust sealing of structural parts joints:Seismic caulking and sealing of electronic chassis panels, wiring harness penetrations, and connector edges。

4. Strong mutual adhesion of multiple materials:Reliable mutual adhesion and fixation of metal, hard engineering plastics (ABS/PVC/PMMA) and epoxy circuit board materials in industrial automation equipment。

Construction technology and usage suggestions

1. Surface decontamination:Before gluing, remove oil, dust, tin slag, flux residue and moisture from the surface of the substrate to be bonded, and keep the bonded surface dry and clean.

2. Dispensing operation:This product has high viscosity (120,000~150,000 cps), supports pneumatic dispensing machine pressure feeding or manual extrusion coating;Excellent thixotropic properties, breaks immediately when glue is stopped, and is not easy to hang or string.。

3. Drying and curing:

• As the solvent naturally evaporates at room temperature, the surface gradually forms and dries.；

• If you need to quickly increase the assembly strength, you can apply60℃ ~ 100℃Heating and baking to accelerate cross-linking and improve shear bonding strength。

4. Dilution instructions:If the production line process needs to adjust the viscosity, it is recommended to use toluene or ethyl ketone (MEK) for preparation. It is strictly prohibited to mix CFC-containing substances or moisture.。

5. Safety and storage:This product contains organic solvents and is flammable. The glue application workshop must be equipped with local exhaust devices and open flames are strictly prohibited. Please seal the lid of the container at any time after use and store it in a cool, dry and light-proof place.。