Product overview
MOMENTIVE / GE TOSHIBA TSE399 one-component low viscosity flow type dealcoholized silicone rubber
TSE399 is a one-component, low viscosity, fast surface drying and room temperature moisture-curing dealcoholized elastic silicone rubber.This product absorbs moisture in the air and solidifies into a highly elastic rubber body, the curing by-product is alcohol, which has extremely low odor and is completely non-corrosive to copper and conventional electronic metals.
Benefit from excellent flow self-leveling and slit penetration capabilities, TSE399 can adhere tightly to a variety of substrates without additional primer.is an ideal solution for thin-layer encapsulation of electronic components, adhesive sealing of fine joints, and moisture-proof and dust-proof coating on the surface of circuit boards (PCB).
Core technical features and advantages
Good flow and permeability: 23°C viscosity is only 2.0 Pa·s(20 P), has excellent self-leveling properties and can easily penetrate into tiny gaps and narrow dead corners of electronic devices.
No corrosion of metal (dealcohol neutral system): conform to MIL-A-46146B Military standard corrosion resistance test requirements, the curing process does not release acidic substances and is completely harmless to precision conductive metals such as bare copper and brass.
Quick drying: The drying time to touch at 23°C only takes about approx.10 minutes, quickly finalize the shape and speed up the production line rhythm.
Wide range of high and low temperature tolerance: Available at -55 °C to 200 °C Maintains flexibility, elasticity and sealing protection properties for a long time under extreme environmental temperature differences.
Excellent electrical insulation properties: Volume resistivity reaches 2× 10¹⁵ Ω·cm , dielectric strength reaches 20 kV/mm, providing a high electrical strength barrier for sensitive circuits.
Primer-free bonding for a wide range of applications: Demonstrates excellent bonding reliability to common metals (copper, aluminum, stainless steel, etc.), engineering plastics (ABS, PBT, PC, PPS, etc.), glass and ceramics.
Typical application areas
PCB circuit board moisture-proof coating: Moisture-proof, insulating, and salt-spray-proof surface protection of precision circuit boards, power boards, and sensor modules.
Tiny gap adhesive sealing: Waterproof and dustproof sealing through the fine gaps of various instrument casings, terminal posts, display edges and precision connectors.
Thin layer potting of components: Thin-layer encapsulation and seismic fixation of relays, capacitors, micro-transformers and high-precision electronic components.
Technical physical parameters (TDS data)
Properties before curing:
| Performance indicators | Test conditions/specifications | Parameter value |
| Appearance | Visually | Fluid liquid (common specifications such as transparent/white) |
| Curing system | — | One-component moisture curing · dealcoholization type (low odor, non-corrosive) |
| viscosity | 23°C | 2.0 Pa·s (20 P / about 2, 000 cP) |
| Tack-Free Time | 23°C | 10 minutes |
| Metal corrosiveness | MIL-A-46146B | No corrosion (qualified) |
Properties after curing (23°C / 50% RH, cured for 7 days):
| Performance indicators | Test Standard/Unit | Parameter value |
| proportion | 23°C | 1.04 |
| hardness | Type A (Shore A) | 25 |
| tensile strength | MPa(kgf/cm²) | 1.3(13) |
| Elongation at break | % | 140% |
| Shear bond strength | MPa(kgf/cm²) | 0.3(3) |
| thermal conductivity | W/m·K(cal/s·cm·°C) | 0.18(4.4×10⁻⁴) |
| Volume resistivity | MΩ·m(Ω·cm) | 2× 10⁷(2× 10¹⁵) |
| Dielectric strength | kV/mm | 20 |
| Dielectric constant | 60Hz | 2.9 |
| dielectric loss tangent | 60Hz | 0.005 |
| Temperature resistance range | Long-term continuous temperature resistance | -55 °C - 200 °C |
Instructions for use and construction points
Substrate pre-cleaning: Before gluing, please ensure that the bonding coating surface is dry and free of oil, dust and water vapor to improve adhesion reliability.
Coating method: TSE399 lower viscosity, supports manual dispensing, syringe dispensing, automatic dispensing machine gluing, brushing or dipping.
Deep curing requirements: One-component silicone relies on external moisture to cure, it is recommended that the thickness of the single layer of potting be controlled within a suitable depth range, and the next process or power test can be carried out after complete curing.
Packaging specifications and storage methods
Original packaging specifications: 100g sticks (20 sticks/box), 333ml tubes (50 sticks/box), 1kg cans (10 cans/box) and 18kg drums.
Storage and safekeeping: The container must be tightly closed after use to prevent moisture from infiltrating and causing local gel; store in a cool, dry warehouse environment away from direct sunlight.
