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Momentive RTV100 series food-grade acidic silicone

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Product overview

MOMENTIVE™ RTV100 series high-performance one-component deacetic silicone rubber sealant

Momentive RTV100 series (including RTV102, RTV103, RTV106, RTV108, RTV109, RTV112, RTV116, RTV118) are extremely versatile, ready-to-use one-component room temperature curing elastomeric silicone rubbers. This series cures into tough, durable and elastic silicone rubber by absorbing moisture in the air. The by-product of curing is acetic acid vapor.

Covered in the series Paste does not flow and Self-leveling advection dynamics two forms, and General grade Two temperature resistance grades: high temperature resistance grade (maximum intermittent temperature resistance 315°C), the entire series has passed food-grade FDA, NSF certification and UL flame-retardant insulation certification.can meet the stringent requirements from precision electronic potting, food mechanical sealing to high-temperature equipment bonding.

Series selection and core classification

  • Universal paste type (suitable for facade and top surface construction, no sag):

    • RTV102: White paste, general adhesive sealing and electrical insulation.

    • RTV103: Black paste, mechanical housing seal, formed-in-place gasket (FIPG).

    • RTV108: Translucent paste (good light transmittance, USP Class VI biocompatibility certified).

    • RTV109: Aluminum color paste, used for appearance modification and assembly sealing of metal and mechanical equipment.

  • High temperature resistant type (long-term temperature resistance 260°C, intermittent temperature resistance up to 315°C):

    • RTV106: Red paste, high temperature resistant electric heating pipe seal, engine and high temperature pipe flange seal.

    • RTV116: Red self-leveling liquid, high temperature resistant thin layer potting, tiny gap penetration coating.

  • Universal self-leveling type (suitable for thin-layer potting, filling fine gaps and dipping protection):

    • RTV112: White self-leveling, good fluidity, suitable for filling deep concave gaps.

    • RTV118: Translucent self-leveling (passed USP Class VI biocompatibility certification), suitable for transparent packaging protection of electrical components.

Core Features and Benefits

  • Ready to use, room temperature moisture curing: No need for weighing and mixing, no need for high-temperature baking, one-component and convenient adhesive application.

  • Excellent high and low temperature stability: The whole series is resistant to cold embrittlement temperature up to -60°C; General model long-term temperature resistance 204°C (short-term 260°C), high-temperature models with long-term temperature resistance 260°C (short-term 315°C).

  • Multiple authoritative industry certifications:

    • food safety: Meets FDA 21 CFR 177.2600 Rubber Standard, USDA Approval and NSF International Std. No. 51 Food Contact Approval.

    • electrical safety: Certified by Underwriters Laboratories (UL) (File No: E-36952).

    • Military standards: Comply with various classification requirements of U.S. military specification MIL-A-46106.

    • medical biocompatibility: Representative samples of RTV108 and RTV118 passed USP Class VI certification.

  • Excellent insulation and weather resistance: Dielectric strength as high as 16~20 kV/mm, with excellent UV resistance, ozone resistance and chemical corrosion resistance.

  • Wide bonding without primer: Has stable self-adhesive force on aluminum, steel, glass, ceramics, silicone rubber and most engineering plastics.

Technical physical property comparison parameter table

Performance indicatorsTest conditions/specificationsGeneral purpose paste (RTV102/103/108/109)Temperature resistant paste (RTV106)Temperature resistant self-leveling (RTV116)Universal self-leveling (RTV112/118)
AppearanceVisually

Paste (White/Black/Trans./Alum.)

red paste

Red self-leveling

Self-leveling (White/Trans.)

Viscosityrotational viscometerpaste thixotropypaste thixotropy

250

200

Extrusion rate (g/min)—

400

400

——
proportion25°C

1.05

1.07

1.09

1.05

Surface drying time (minutes)25°C, 50% RH

20

20

30

20

Hardness (Shore A)Cure 3 days

30

30

20

25

tensile strengthkg/cm² (psi)

28 (400)

26 (375)

25 (350)

23 (325)

Elongation (%)—

450

400

350

325

Shear strengthkg/cm² (psi)

14 (200)

14 (200)

7 (125)

7 (100)

Dielectric strengthkV/mm (v/mil)

20 (500)

20 (500)

16 (400)

16 (400)

Embrittlement point (°C)—

-60

-60

-60

-60

continuous operating temperaturelong term use

204 °C

260 °C

260 °C

204 °C

intermittent peak temperatureshort term endurance

260 °C

315 °C

315 °C

260 °C

Instructions for use and construction precautions

  • Surface cleaning: Before gluing, use Naphtha or MEK to clean the bonded surface, thoroughly remove oil, release agent and moisture and dry it. For difficult-to-adhere substrates, it is recommended to use SS4004, SS4044 or SS4179 primer.

  • Adhesive thickness limit: Since this product relies on air moisture for curing,Do not apply more than 6mm (1/4 inch) thick in a single application. The adhesive layer with a thickness of 3mm will be cured from the outside to the inside in about 24 hours at 25°C and 50% RH.If the structural depth exceeds 6mm, it is recommended to use addition type or two-component silicone rubber.

  • Trimming time: The skin will begin to peel and dry in 15 to 30 minutes at room temperature. Once the rubber is formed, it cannot be scraped or trimmed again.

  • Application taboos:

    • This series is a deacetic acid curing system, which will release trace amounts of acetic acid vapor.Not recommended for electronic circuits that are in contact with sensitive metals such as bare copper and brass that are strictly prohibited from corrosion. (It is recommended to use neutral dealcoholization type such as TSE3941/TSE382 in such scenarios).

    • Prohibited for use in permanent human implants.

  • Cleaning instructions: Before curing, it can be wiped with MEK or naphtha; after complete curing, mechanical peeling or professional chemical adhesive remover is required.


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