ThreeBond 3732 super high temperature resistant inorganic adhesive (temperature resistant up to 1400℃ and above)

Product Overview

ThreeBond 3732 is an ultra-high temperature resistant one-component inorganic adhesive/potting coating material using Metallic Alkoxide as the binder and aluminum-based compounds as the main component.。

Although traditional inorganic adhesives based on silicate or phosphate are heat-resistant above 400°C, they often have inherent defects such as poor water resistance, attenuation of insulation performance with moisture, insufficient air tightness, corrosion of the substrate by strong acids and alkalis, and easy foaming and cracking.. ThreeBond 3732 uses neutral alcohol solvent and micro-powder ceramic filling technology to completely overcome strong acid and alkali corrosion while achieving excellent water resistance, boiling water resistance, high air tightness and long-lasting electrical insulation.. After curing itThe ultimate heat-resistant temperature can reach over 1400℃, supports thick coating construction, and is a cutting-edge solution for bonding, potting, fixing and surface protection under high and ultra-high temperature severe working conditions.。

Core advantages and features

• Extreme high temperature resistance (≥ 1400℃):Measured using the Seger cone method, the upper limit of curing temperature resistance exceeds 1400°C, far exceeding that of conventional organic polymer materials.。

• Neutral formula, does not corrode the substrate:Different from traditional strong acidic phosphate glue and strong alkaline silicate glue, TB 3732 is neutral (pH neutral) and will never corrode metals and sensitive components, ensuring long-term bonding reliability.。

• Excellent water and boiling water resistance:No cracking, peeling, dissolution or discoloration after 2 hours of boiling water cooking test; Excellent hydrophobicity (contact angle with water up to 105°)。

• Stable high temperature electrical insulation:The volume resistivity at room temperature reaches$1 \times 10^{12}\ \Omega\cdot\text{cm}$, still maintained after being cooked in boiling water for 5 hours$2 \times 10^{11}\ \Omega\cdot\text{cm}$, the insulation resistance does not decay after being placed in a high-humidity environment of 40℃ × 95% RH for a week。

• Dense structure and high air tightness:Containing fine ceramic powder, the cured layer has a dense texture, the moisture permeability and moisture absorption rate is only 1/2 to 1/5 of traditional inorganic glue, and the sealing and leakage prevention effect is outstanding。

• Dry and smooth, not prone to blistering:Use low-boiling point alcohol solvents instead of water, the drying and curing process releases smoothly, effectively avoiding the problem of bubbling and brittleness of traditional inorganic adhesives, and supports thick coating and high filler filling.。

Basic physical properties and technical specifications

Electrical and Chemical Resistance Data

1. Electrical insulation properties

• Volume resistivity at room temperature: $1 \times 10^{12}\ \Omega\cdot\text{cm}$

• Volume resistivity after boiling water for 5 hours: $2 \times 10^{11}\ \Omega\cdot\text{cm}$(minimum attenuation)

• Dielectric constant (1 kHz): 6.0

• Dielectric loss tangent (1 kHz): $4.1 \times 10^{-3}$

2. Resistance to chemical reagents (stainless steel plate is soaked after coating and solidification)

• Boiling water (boil for 2 hours):No abnormalities (no cracking, no peeling, no discoloration)

• 5% hydrochloric acid solution (25℃ × 24h):No exception

• Toluene (25℃ × 24h):No exception

• Methanol (25℃ × 24h):No exception

• 5% sodium hydroxide solution (25℃ × 24h):Slight cracks or peeling occur (it is recommended to avoid long-term strong alkali contact)

3. Relationship between curing conditions and shear strength (SPCC-SD steel plate)

• Normal temperature × 24 hours: 20.4 kgf/cm²

• Normal temperature × 72 hours: 23.9 kgf/cm²

• Normal temperature × 168 hours (7 days): 26.2 kgf/cm²

• Heating at 100°C × 30 minutes: 28.7 kgf/cm²(Heating can accelerate the complete reaction and reach peak intensity)

Typical application areas

1. Bonding of ceramics, glass and metal:High-temperature furnace lining, high-temperature probe, ultra-heat-resistant combination of quartz glass and metal components。

2. Sensor and heating element potting:Insulation sealing and packaging protection for temperature sensors (thermocouples, thermal resistors), ignition devices, electric heating rod ends and heaters。

3. Spark plugs and high-heat electronic components:Fixed potting of spark plugs and installation and positioning of electronic components close to the heat source。

4. Heat-resistant thermosetting material composite:Assembly and fixation of ultra-high temperature structural components and high temperature resistant anti-corrosion coating。

5. Anti-coking and anti-carbon deposit coating:Anti-scale surface protective coating to prevent high-temperature carbon deposition and sludge adhesion。

Construction technology and curing specifications

1. Preparation and deployment before construction

• Pre-knead:This product is an inorganic filler slurry and may naturally settle if left for a long time.Before opening the bag, please knead and squeeze it thoroughly through the aluminum foil bag to make the colloid completely uniform.。

• Surface degreasing:The bonding surface must be thoroughly cleaned of grease, dust and rust, and sandblasted if necessary to roughen the surface and improve bonding strength.。

• Dilution instructions:If you need to adjust the viscosity, only high-purity absolute alcohol (methanol, ethanol, isopropyl alcohol) can be added.The addition ratio is strictly prohibited to exceed 5%，Do not mix with moisture(Trace amounts of water will cause the colloidal gel to be scrapped)。

2. Recommended stage curing process

In order to prevent the internal solvent from evaporating too quickly to form tiny pores or cracks, it is recommended to perform gradient baking and curing according to process requirements.：

• Bonding assembly process:Leave at room temperature for 1 hour (or 50°C × 30 minutes), then warm to100℃ for 30 minutes。

• Potting process (thick layer):Leave at room temperature for 2 hours$\rightarrow$Bake at 50℃ for 4 hours$\rightarrow$ 100℃ for 30 minutes。

• Surface coating process:Leave at room temperature for 30 minutes$\rightarrow$Bake at 50℃ for 1 hour$\rightarrow$ 100℃ for 30 minutes。

3. Store after use

Unused colloid must be immediately transferred to a sealable glass container and tightly sealed to prevent moisture absorption and solvent evaporation.。