DY-163 flame-retardant electronic insulation yellow adhesive (component fixing adhesive / UL94 V-0)

Product overview

DY-163 is a high-performance single-component self-extinguishing flame-retardant electronic rubber made of high-grade chloroprene rubber (Chloroprene Rubber) as the main component.This product is fully benchmarked and can directly replace the industry’s classic Eastern Fine Refinement MAXBOND 1603HFR-HS.

The product has excellent electrical insulation properties, excellent heat resistance and thixotropic filling properties.not easy to sag under normal pressure, flows smoothly when shearing external force is applied, and is not easy to wire drawing during dispensing operations (Cobwebbing). After curing, the flame-retardant level reaches UL94 V-0 level standard, can effectively realize the insulation, sealing, dustproof, anti-vibration and wave soldering anti-shift fixation of electronic and electrical components. It is widely used in various switching power supplies, adapters, household appliances and industrial control board components.

Core advantages and features

• Strictly meet UL94 V-0 flame-retardant standards: It has excellent self-extinguishing flame-retardant properties. It has demonstrated excellent self-extinguishing performance in both 0.8mm and 3.2mm specifications tests, completely blocking the spread of electrical fires.

• Excellent electrical insulation properties: According to the JIS K6911 standard test, under the condition of 500V DC, even if it is continuously aged for 1000 hours at a high temperature of 80°C ~ 100°C, the surface insulation resistance is still stably maintained in the high impedance range of 10¹¹ ≈ 10¹⁴ Ω.

• Excellent thixotropy and construction resistance to wire drawing: Good thixotropy, full dispensing molding, and not easy to sagging during facade construction, clean adhesive cutting without stringing, especially suitable for manual dispensing gun or automated dispensing line operations.

• Strong bonding and anti-vibration buffering: It has high adhesion and tear-resistance to various engineering plastics, metals, rubber, glass and copper-clad laminates.effectively absorbing mechanical impact and drop vibrations.

• Excellent temperature and weather resistance: Softening point reached Above 200°C (ASTM D-816-55), withstand low temperature (-20°C) to high temperature and hot and humid conditions, it still maintains good elasticity and bonding strength after being placed for many years.

Basic technical indicators and physical parameters

Mechanical properties and weathering data

1. Peel strength test (unit: kg/in, strength continues to increase over time)

• Iron plate / canvas (Fe / Canvas): 1 hour 2.4 → 24 hours 6.4 → 96 hours 10.6 → 168 hours 11.2

• Iron/Neoprene (Fe/CR): 1 hour 2.0 → 24 hours 5.0 → 168 hours 6.8

• Iron plate / polyester film (Fe / Polyester Film): 1 hour 1.8 → 24 hours 3.2 → 168 hours 5.4

• Melamine coated iron/canvas: 1 hour 1.7 → 24 hours 6.0 → 168 hours 9.4

• PS foam material / natural rubber: 1 hour 2.5 → 24 hours 3.8 → 168 hours 8.3

2. Environmental aging resistance test (peel strength performance)

• Low temperature resistance (-20°C): Iron plate/canvas 12.2 kg/in, iron plate/chloroprene 7.3 kg/in, PS foam/natural rubber 8.1 kg/in (excellent low temperature toughness and not brittle).

• Heat aging resistance (70°C × 96h): Iron/Canvas remains at 10.3 kg/in, Iron/Neoprene remains at 6.5 kg/in.

• Water resistance (soaked in normal temperature water for 48 hours): Iron/Canvas remains at 8.6 kg/in, Iron/Neoprene remains at 5.8 kg/in.

3. Cured hardness and ductility

• Hardness change (JIS K6301): The hardness is about 70 (Shore A) in 10 days at 20°C.up to 76 in 30 days, long-term aging is stable at 89~90; It can quickly reach 90 in 10 days under accelerated heating at 70°C.

• Elongation at break: Elongation rate up to 300% at room temperature 20°C; Retains 240% seismic tensile elongation after being placed outdoors for 7 years.

Typical application areas

1. Fixing large-size components on PCB board: Anti-vibration and anti-fall positioning of large electrolytic capacitors, high-frequency transformers, inductors, heat sinks and relays on switching power supplies, inverters and charging pile motherboards.

2. Wave soldering anti-displacement: Before the circuit board undergoes wave soldering, the plug-in vertical components are bonded and positioned to prevent the components from becoming skewed, floating or falling off.

3. Insulation and sealing of electronic and electrical components: Moisture-proof, insulating and dust-proof protective sealing of exposed pin terminals, terminals, sensors and connectors.

4. Universal bonding of multiple materials: Strong mutual adhesion of various metals, engineering plastics, rubber bushings, glass and wooden boards in electronic structural parts.

Use technology and construction specifications

1. Substrate surface cleaning: Before applying adhesive, be sure to remove moisture, grease, soldering oil, flux residue and dust from the surface to be bonded.

2. Adhesive dispensing method:

• Component positioning and filling: It can be directly loaded into a manual/pneumatic dispensing barrel for fixed-point injection. The adhesive relies on thixotropy to accumulate at the bottom of the component or around the pin.

• Large area coating and bonding: Use a brush or scraper to apply evenly and evenly. The recommended amount of adhesive applied is 150 ~ 250 g/m²; After coating on both sides, let it sit at room temperature for 5 to 10 minutes.align and press tightly (can be used with 80°C hot pressing for 2~3 minutes to accelerate shaping).

3. Safe operation tips: This product contains organic volatile solvents. The gluing operation area must be equipped with good local exhaust and ventilation facilities.Strictly prohibit fireworks and static sparks; Avoid direct skin contact, it is recommended to wear anti-penetration gloves and protective glasses during operation.

4. Sealed storage: If the adhesive barrel is not used up after opening, the lid must be tightly sealed immediately and stored in a cool, dry and ventilated place to prevent solvent evaporation from affecting the viscosity.